A week ago (April 21, 2021), I participated in Wireless Telecommunitions Symposium (WTS) 2021 as a panelist. The topic of my presentation was “Reconfigurable Intelligent Surfaces for High Frequency Communications: The newest gambit of the wireless world.” The presentation had four parts:
In the first part, key requirements of beyond the fifth generation (B5G) applications were discussed. In more detail, it was explained that B5G applications is expected to achieve unprecented excellence in terms of high data-rate, reliability, latency, energy efficiency and security. After recognizing the requirements, we explained why 5G spectrum is not enough to support them as well as the reason for moving to higher frequency bands, such as the THz one. The maturity of THz technologies and the particularities of this band were presented. In particular, we identified the following particularities of THz systems: i) high spreading loss, ii) molecular absorption loss, iii) distance-dependent bandwidth, iv) sensitivity to antenna misalignment, v) high penetration loss that is translated to sensitivity to blockage, and vi) transceivers’ hardware imperfections.
In the second part, we provided results that quantify the impact of blockage in such systems and presented a new artificial structure, namely Reconfigurable intelligent Surfaces” that is capable of altering the electromagnetic environment in order to create beneficial propagation conditions. After explaining its structure and functionalities, we reported indicative and envisioned application scenarios.
In the third part, we compared RIS technology with its predecessor, namely relaying in terms of outage probability, diversity gain and order, average SNR, and error rate. The results revealed that RIS-assisted wireless systems can clearly outperform relaying ones. For more details, please refer to the corresponding paper here.
Finally, in the forth part, we discussed the impact of transceivers’ hardware imperfections in RIS-assisted wireless systems. For more details, please refer to the corresponding paper here.
I would like to take this opportunity to thank the organizers for the invitation and great hosting.